![]() Takyi, Optimisation of thermo-fatigue reliability of solder joints in surface mount resistor assembly using Taguchi method. ![]() Otiaba, Prediction and optimisation of design parameters of microelectronic heat sinks. Lepistö, The effect of solder paste composition on the reliability of SnAgCu joints. Wong, Isotropically conductive adhesives (ICAs). Wong, in Materials for Advanced Packaging, ed. Zimmermann, Effect of voids on thermo-mechanical reliability of chip resistor solder joints: experiment, modelling and simulation. Toleno, Investigation of the lead-free solder joint shear performance. Toleno, Effects of reflow profile and thermal conditioning on intermetallic compound thickness for SnAgCu soldered joints. Park, Smarter temperature setup for reflow oven to minimise temperature variation among components. Park, Determination of smarter reflow-profile to achieve a uniform temperature throughout aboard, in 2021, 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) (IEEE, 2021), pp. Frémont, Evaluation of SAC solder joint thermomechanical fatigue in different types of components, in 2022 23rd International Conference on Thermal, Mechanical and Multi-physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (IEEE, 2022), pp. Steen, Lead-free reflow soldering for electronics assembly. Krolczyk, Experimental and numerical assessment of temperature field and analysis of microstructure and mechanical properties of low power laser annealed welded joints. Stano, Microstructure and properties of hybrid laser arc welded joints (laser beam-MAG) in thermo-mechanical control processed S700MC steel. Sun, Microstructure and mechanical properties of friction stir welded AA6092/SiC metal matrix composite. Higgins, Effects of flux materials on the moisture sensitivity and reliability of flip-chip-on-board assemblies. Shur, Effect of surface finishes on ball shear strength in BGA joints with Sn-3.5 mass% Ag solder. Abdullah, Thermo-mechanical challenges of reflowed lead-free solder joints in surface mount components: a review. Gopalan, in Electronics Production Defects and Analysis (Springer, Singapore, 2022), eBook, page count 140.Ĭ.S. Lee, Optimising the reflow profile via defect mechanism analysis. Njoku A Study of the Thermomechanical Reliability of Solder Joints in Surface Mount Electronics Technology (Doctoral dissertation, University of Greenwich) (2016). Saladukha, Packaging technologies for electronic devices, High-Speed Digital System Design. Sakuma (CRC Press, Boca Raton, 2020), pp. ![]() Graddage, Components and devices, in Flexible, Wearable, and Stretchable Electronics, ed. Miller, Low-temperature solder interconnection of surface mount devices with additively printed pads on flexible substrate, in The 20 th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) (2021), pp. These results will be useful for electronic packaging and reliability engineers faced with challenges of improving device operational mechanical performance in the continuing trend of product miniaturisation. The solder joint shear strength decreased with a decrease in the size of the lead-free joint irrespective of the reflow profile implemented. Reflow profile number 3 constituting 1.2☌/s preheat, 45 s TAL, 245☌ peak temperature and 60% cooling rate is optimal because it yielded joints with the highest strength and ca. Three test vehicles of varying solder joint sizes are made from R1206, R0805 and R0603 resistors. The factors/parameters investigated are preheat gradient, time above liquidus (TAL), peak temperature and cooling rate. The Taguchi design of experiment (DoE) is employed to generate eight orthogonal array designs of L2 4 reflow profiles. This study proposes an optimal parameter combination of reflow profile factors which demonstrate potential for delivering maximum shear strength of solder joints. The miniaturisation trend in the development of electronic products has continued to challenge the shear strength of the solder joints in these devices and necessitates implementation of optimal reflow profiles to achieve maximum joint strength. The integrity of solder joints of components in an electronic device is critical to the device reliability.
0 Comments
Leave a Reply. |
AuthorWrite something about yourself. No need to be fancy, just an overview. ArchivesCategories |